US Patent Issued to SAMSUNG ELECTRONICS on Sept. 9 for "Semiconductor package utilizing a hybrid bonding process and method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,871, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package utilizing a hybrid bonding process and method of manufacturing the same" was invented by Jihoon Kim (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a peripheral region having a groove and a bonding region that is disposed higher than the groove. The second semiconductor chip is disposed in the bonding region of the first semiconductor chip. The second semiconductor chip is directly...