US Patent Issued to SAMSUNG ELECTRONICS on Sept. 9 for "Semiconductor package and memory device including the same" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,849, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and memory device including the same" was invented by Hyunjin Kim (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a package board including a plurality of connection pads; a semiconductor chip including a first surface and a plurality of bonding pads, wherein the first surface of the semiconductor chip contacts a first surface of the package board, and wherein the plurality of bonding pads are respectively connected to the plurality of connection pads; and a thermal fuse circ...