ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,875, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Seungmin Kim (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate having a passive element region, a peripheral region adjacent to the passive element region, and a remaining region, a first passive element on an upper surface of the passive element region, a first semiconductor chip on an upper surface of the remaining region, and a sealing portion covering the substrate, the first passive element, and the first semiconductor chip, wherein the peripheral r...