US Patent Issued to SAMSUNG ELECTRONICS on Sept. 9 for "Integrated circuit package for scan testing semiconductor chip, operating method of integrated circuit package, and integrated circuit" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,175, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Integrated circuit package for scan testing semiconductor chip, operating method of integrated circuit package, and integrated circuit" was invented by Taewoong Ahn (Suwon-si, South Korea), Youngin Park (Suwon-si, South Korea) and Junyeong Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package for scan testing a semiconductor chip includes at least one first input pad configured to receive a first input signal, at least one chip connected to the first input pad, and at least one first output pad configu...