US Patent Issued to SAMSUNG ELECTRONICS on Sept. 9 for "Chip-on-film packages and display apparatuses including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,826, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Chip-on-film packages and display apparatuses including the same" was invented by Jungeun Koo (Hwaseong-si, South Korea) and Yechung Chung (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-on-film package includes a base film having a top surface and a bottom surface, and a circuit region; a source driver chip and a gate driver chip mounted on the circuit region; a first conductive line on the top surface of the base film, a second conductive line on the bottom surface of the base film, and a conductive via that connects the ...