ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,050, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package with protective mold" was invented by Sun Jae Kim (Seoul, South Korea), Sun Kyoung Seo (Cheonan-si, South Korea) and Yong Hoe Cho (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for fabricating a semiconductor package. The method includes partially cutting a wafer along a boundary of a unit wafer to form a transparent substrate including a first part having a first width and a second part and mounting an image sensor chip on the second part of the transparent substrate. The image sensor c...