US Patent Issued to SAMSUNG ELECTRONICS on Sept. 30 for "Semiconductor package including thermal interface material (TIM) layers on semiconductor chips" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,403, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including thermal interface material (TIM) layers on semiconductor chips" was invented by Kiwook Jung (Suwin-si, South Korea), Jaechoon Kim (Incheon, South Korea), Seunggeol Ryu (Seoul, South Korea) and Sungeun Jo (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes first and second semiconductor chips mounted on an interposer structure, an insulating filler covering sides of the first and second semiconductor chips, a first thermal interface mater...