ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,474, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Ju-Il Choi (Seongnam-si, South Korea), Un-Byoung Kang (Hwaseong-si, South Korea), Minseung Yoon (Yongin-si, South Korea), Yonghoe Cho (Cheonan-si, South Korea), Jeonggi Jin (Seoul, South Korea) and Yun Seok Choi (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package, including a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, first bumps between the first redistribution substrate and the first semiconductor chip, ...