US Patent Issued to SAMSUNG ELECTRONICS on Sept. 30 for "Semiconductor chips having recessed regions" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,442, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Semiconductor chips having recessed regions" was invented by Jinduck Park (Asan-si, South Korea), Chansik Kwon (Asan-si, South Korea), Yongseong Kim (Asan-si, South Korea), Inwook Im (Cheonan-si, South Korea) and Jiyeon Han (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip includes a semiconductor substrate including a device region, and an edge region surrounding the device region, a device layer on the semiconductor substrate, a wiring layer on the device layer, a side surface of the wiring layer at least part...