US Patent Issued to SAMSUNG ELECTRONICS on Sept. 30 for "Printed circuit board and semiconductor package which include multi-layered photosensitive insulating layer" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,463, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Printed circuit board and semiconductor package which include multi-layered photosensitive insulating layer" was invented by Hyejin Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board may include a substrate body portion, conductive patterns on a top surface of the substrate body portion, and a photosensitive insulating layer on the top surface of the substrate body portion and including an opening exposing at least one of the conductive patterns. The photosensitive insulating layer includes first to third su...