US Patent Issued to SAMSUNG ELECTRONICS on Sept. 30 for "Method of manufacturing semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,479, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of manufacturing semiconductor package" was invented by Jakyoung Gu (Suwon-si, South Korea), Minsoo Kim (Suwon-si, South Korea), Jihye Shim (Suwon-si, South Korea) and Kyoungok Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package includes forming a plurality of conductive patterns on a substrate, forming a photoresist film over the substrate to cover the plurality of conductive patterns, forming a photoresist pattern from the photoresist film by a photolithography process usin...