US Patent Issued to SAMSUNG ELECTRONICS on Sept. 30 for "Method and apparatus for handling integrity verification failure in system supporting high-reliability, low-latency service" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,814, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method and apparatus for handling integrity verification failure in system supporting high-reliability, low-latency service" was invented by Donggun Kim (Suwon-si, South Korea) and Soenghun Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a communication technique and a system therefor, the communication technique for merging, with an IoT technology, a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate since a 4th generation (4G) communication system...