US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing method" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,754, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing method" was invented by Jihoon Jeong (Seongnam-si, South Korea), Seohyun Kim (Hwaseong-si, South Korea), Sukhoon Kim (Seongnam-si, South Korea), Younghoo Kim (Yongin-si, South Korea), Sangjine Park (Suwon-si, South Korea) and Kuntack Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a processing chamber providing a processing space for processing a substrate and processing a substrate, a substra...