US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Solder reflow apparatus and method of manufacturing electronic device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,348, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Solder reflow apparatus and method of manufacturing electronic device" was invented by Youngja Kim (Suwon-si, South Korea) and Sunwon Kang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated; a heater configured to heat the heat transfer fluid to generate saturated vapor; a substrate stage configured to be moved up and down within the vapor ge...