US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Semiconductor package including a plurality of semiconductor chips" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,582, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including a plurality of semiconductor chips" was invented by Hyeonjun Song (Suwon-si, South Korea), Jungmin Ko (Suwon-si, South Korea), Taehyeong Kim (Suwon-si, South Korea), Youngwoo Lim (Suwon-si, South Korea) and Dongki Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base chip; semiconductor chips stacked on the base chip; bumps, a lowermost bump of the bumps disposed between the base chip and a lowermost semiconductor chip of the semiconductor chips, and each of the ...