US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Semiconductor package and thermal management method thereof" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,907, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and thermal management method thereof" was invented by Jungpil Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and thermal management methods thereof. The semiconductor package includes an upper semiconductor chip; and a lower semiconductor chip connected via a plurality of through electrodes to the upper semiconductor chip. The lower semiconductor chip may include at least one temperature sensor configured to sense a temperature of the upper semiconductor chip, a ...