US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Semiconductor package and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,530, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and manufacturing method thereof" was invented by Byung Wook Kim (Suwon-si, South Korea), A-Young Kim (Yongin-si, South Korea), Seong Won Jeong (Seoul, South Korea) and Sang Su Ha (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package capable of reducing or preventing cracks from occurring in a conductive bump and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a first conductive bump; a first re-distribution layer which is provided between the semi...