US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Semiconductor package and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,601, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and manufacturing method thereof" was invented by Choongbin Yim (Seoul, South Korea) and Jinwoo Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a package substrate; a semiconductor chip mounted above the package substrate; a chip connection terminal interposed between the semiconductor chip and the package substrate; an adhesive layer disposed on the package substrate and that covers a side and a top surface of the semiconductor chip and surrounds the chip connection terminal...