US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Semiconductor device and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,312, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device and method for fabricating the same" was invented by Tea Won Kim (Hwaseong-si, South Korea), Hyung Joon Kim (Yongin-si, South Korea), Yong-Suk Tak (Seoul, South Korea), Yu Rim Kim (Hwaseong-si, South Korea) and Kong Soo Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a conductive line that extends in a first direction on a substrate, a first oxide semiconductor layer, including a first crystalline oxide semiconductor material containing a first metal element, on the conduct...