US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "High temperature test device of semiconductor memory module and method for controlling module temperature thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,473, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"High temperature test device of semiconductor memory module and method for controlling module temperature thereof" was invented by Sunhee Kim (Suwon-si, South Korea), Sun-Gi Lee (Suwon-si, South Korea) and Soo-In Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a high temperature test device of a memory module. The high temperature test device includes: an airtight housing configured to seal the memory module mounted on a main board; a heater disposed above the main board inside the airtight housing; a first fan disp...