US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Bonding quality test method, bonding quality test circuit, and memory device including bonding quality test circuit" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,466, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Bonding quality test method, bonding quality test circuit, and memory device including bonding quality test circuit" was invented by Sangsu Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding quality test circuit includes a switching circuit configured to provide a connection between a sensing node and a bonding node, the bonding node corresponding to a first end of a bonding resistor that is between a line provided to a memory device and a peripheral circuit, a precharging circuit configured to provide a precharge voltag...