US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Apparatus for bonding chip band method for bonding chip using the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,585, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Apparatus for bonding chip band method for bonding chip using the same" was invented by Euisun Choi (Hwaseong-si, South Korea), Huijae Kim (Jeju-si, South Korea), Mingu Lee (Cheonan-si, South Korea), Hyeonggyun Cheong (Suwon-si, South Korea) and Yunpyo Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting ...