ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,972, issued on Sept. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).
"Stacked offset semiconductor package" was invented by Hwan-Wook Jung (Gwangmyeong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising a first chip stack including on a substrate a plurality of first semiconductor chips in an offset stack structure and stacked to expose a connection region at a top surface of each of the first semiconductor chips, a second semiconductor chip on the substrate and horizontally spaced apart from the first chip stack, a spacer on the second semiconductor chip, and a ...