US Patent Issued to SAMSUNG ELECTRONICS on Sept. 16 for "Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,248, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same" was invented by Hyojin Park (Hwaseong-si, South Korea), Songyun Kang (Suwon-si, South Korea), Sung Yong Park (Suwon-si, South Korea) and Keon-Woo Kim (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a substrate polishing method comprising placing a substrate into a substrate polishing apparatus, rotating each of the substrate and a polishing pad of the substrate polishing apparatus, allow...