ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,971, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package with multilayer bonding pads" was invented by Daae Ko (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate that includes an upper protection layer and a plurality of upper bonding pads, a semiconductor chip on the substrate, and a plurality of bonding wires connected to the semiconductor chip and the upper bonding pads. Each of the upper bonding pads includes a first conductive pattern, a second conductive pattern that covers a top surface and a sidewall of the first con...