ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,972, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Jongyoun Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes: a first redistribution substrate; a semiconductor chip provided on the first redistribution substrate; a molding layer provided on the first redistribution substrate and the semiconductor chip; and a second redistribution substrate provided on the molding layer. The second redistribution substrate includes: redistribution patterns spaced apart from one another; a...