ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,917, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Methods for fabricating semiconductor devices" was invented by Sung Kun Kang (Seoul, South Korea), Hyun Woo Kim (Seongnam-si, South Korea) and Cheol In Jang (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes forming a first mask layer on a substrate, forming an under layer on the first mask layer, forming a first photoresist pattern that includes tin on the under layer, converting at least a part of the first photoresist pattern into a second photoresist pattern including tin fluori...