US Patent Issued to SAMSUNG ELECTRONICS on Sept. 16 for "Method of verifying semiconductor device, method of designing and manufacturing semiconductor device using the same, and system performing the same" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,330, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of verifying semiconductor device, method of designing and manufacturing semiconductor device using the same, and system performing the same" was invented by Junro Lee (Gunpo-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of verifying a semiconductor device, input data defining the semiconductor device including a plurality of blocks is received. A first simulation environment is generated for a top module and at least one target block of the plurality of blocks in the top module. The first simulation environment includ...