US Patent Issued to SAMSUNG ELECTRONICS on Sept. 16 for "Interposer, method for fabricating the same, and semiconductor package having the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,988, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Interposer, method for fabricating the same, and semiconductor package having the same" was invented by Yukyung Park (Hwaseong-si, South Korea), Ungcheon Kim (Cheonan-si, South Korea) and Wonil Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad re...