ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,122, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Image sensor package" was invented by Dong Hoon Kang (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor package includes: a solder resist layer wrapping a redistribution layer and a connection pad; a mold layer on the solder resist layer and including an inner wall and an opposing outer wall, the inner wall defining a sensor array region; a logic chip on the solder resist layer and in the sensor array region, and contacting the mold layer; an image sensor chip on the logic chip and in the sensor array region, and con...