US Patent Issued to SAMSUNG ELECTRONICS on Sept. 16 for "Electronic device including bracket formed of metal material" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,949, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device including bracket formed of metal material" was invented by Jungsik Park (Suwon-si, South Korea), Wonjoon Choi (Suwon-si, South Korea), Woongeun Kwak (Suwon-si, South Korea) and Hyunju Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is provided. The electronic device includes a foldable housing including a hinge structure, a first housing connected to the hinge structure and including a first side wall structure and a first bracket located inside the first side wall structure, and a second...