ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,947, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Electronic device comprising housing assembly structure" was invented by Heecheul Moon (Suwon-si, South Korea), Gyeongtae Kim (Suwon-si, South Korea) and Moohyun Baek (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is provided. The electronic device includes: a first plate; a second plate; a lateral member provided around a space between the first plate and the second plate, the lateral member including a conductive part and a nonconductive part; a frame member provided at least partly along a border of the late...