US Patent Issued to SAMSUNG ELECTRONICS on Oct. 7 for "Semiconductor package with bonding interface" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,064, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package with bonding interface" was invented by Minki Kim (Suwon-si, South Korea), Seungduk Baek (Hwaseong-si, South Korea), Soojeoung Park (Hwaseong-si, South Korea) and Hyuekjae Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode that penetrates through the first semiconductor layer, a first bonding pad connected to the first through-electrode, and a first insulating bonding layer, and a second ...