ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,059, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Namhoon Kim (Gunpo-si, South Korea) and Kwangyoul Lee (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip; a lower dam structure disposed on an edge of a top surface of the first semiconductor substrate; a second semiconductor chip, which is mounted on the first semiconductor chip; an upper dam structure disposed on an edge of the bottom surface of the second semiconductor substrate; a chip connecting terminal disposed between the first s...