ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,133, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Joonsung Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a connection substrate on a package substrate and has an opening that penetrates therethrough. A chip stack is on the package substrate and in the opening. A redistribution layer is on the connection substrate and the chip stack. An upper semiconductor chip is on first redistribution pads of the redistribution layer. External terminals are on a bottom surface of the package substrate. The chip stack includ...