US Patent Issued to SAMSUNG ELECTRONICS on Oct. 7 for "Package substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,134, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Package substrate and semiconductor package including the same" was invented by Junwoo Park (Anyang-si, South Korea), Sangsoo Kim (Cheonan-si, South Korea), Seunghwan Kim (Anyang-si, South Korea), Jungjoo Kim (Daegu, South Korea) and Yongkwan Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate including a base substrate including a redistribution layer, pads disposed on first and second surfaces of the base substrate and connected to the redistribution layer, and a protective layer...