US Patent Issued to SAMSUNG ELECTRONICS on Oct. 7 for "Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,014, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same" was invented by Jaehyuk Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light irradiation apparatus including a stage configured to support a substrate; and a light emitting diode (LED) module spaced apart from the stage, wherein the LED module includes a plurality of LEDs, wherein some of the plurality of LEDs are arranged in a first direction, and wherein others of the plurality of LEDs are provided in a se...