US Patent Issued to SAMSUNG ELECTRONICS on Oct. 7 for "Layout method of semiconductor chip, semiconductor chip manufacturing method and computing device using same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,138, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Layout method of semiconductor chip, semiconductor chip manufacturing method and computing device using same" was invented by Akio Misaka (Hwaseong-si, South Korea), Noyoung Chung (Hwaseong-si, South Korea), Taekyum Kim (Suwon-si, South Korea), Sanghwa Lee (Seoul, South Korea) and Woonhyuk Choi (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A layout method of a semiconductor chip, includes designing a layout using a restriction rule such that a layout pattern having a length smaller than a first length in a first direction has to ha...