US Patent Issued to SAMSUNG ELECTRONICS on Oct. 7 for "Image sensor package and system having the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,715, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Image sensor package and system having the same" was invented by Sunjae Kim (Seoul, South Korea), Chungho Song (Suwon-si, South Korea) and Yonghoe Cho (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor package includes: a package base substrate having a cavity extending inwards from an upper surface thereof, and including a plurality of upper surface connection pads and a plurality of lower surface connection pads; an image sensor chip in the cavity, and including a chip body having a first surface and a second surface fa...