ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,341, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Electrostatic chuck apparatus" was invented by Yoshiaki Moriya (Kanagawa, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck apparatus is provided that is capable of effectively reducing temperature imbalance of a wafer substrate that is heated to a high temperature. The electrostatic chuck apparatus includes a base including a cooling flow path through which a refrigerant may flow, an adiabatic layer on the base, a uniform heating plate on the adiabatic layer, a heating element between the adiabatic layer and the uniform heati...