ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,009, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Apparatus for mounting solder balls" was invented by Young-Ja Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for mounting solder balls comprises a stage to support a substrate thereon, a mounting unit to mount solder balls on the substrate, and a solder ball mask between the mounting unit and the substrate. The solder ball mask includes a first face facing the substrate and a second face opposite to the first face. The solder ball mask has inner surfaces defining through-holes extending through a thickness of the so...