US Patent Issued to SAMSUNG ELECTRONICS on Oct. 28 for "Substrate processing apparatus and substrate processing method" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,610, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus and substrate processing method" was invented by Sung Hwi Cho (Gwangju-si, South Korea), Sung-Yeol Kim (Yongin-si, South Korea), Mee Hyun Lim (Seoul, South Korea), Sung Yong Lim (Seoul, South Korea), Seong Ha Jeong (Hwaseong-si, South Korea) and Woong Jin Cheon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus is provided. The substrate processing apparatus includes a chamber comprising a support, the support configured to have mounted thereon a substrate; at least one chan...