US Patent Issued to SAMSUNG ELECTRONICS on Oct. 28 for "Substrate processing apparatus, signal source device, method of processing material layer, and method of fabricating semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,603, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus, signal source device, method of processing material layer, and method of fabricating semiconductor device" was invented by Sung-gil Kang (Hwaseong-si, South Korea), Min-seop Park (Hwaseong-si, South Korea), Gon-jun Kim (Suwon-si, South Korea), Jae-jik Baek (Seongnam-si, South Korea), Jae-jin Shin (Seoul, South Korea) and In-hye Jeong (Changnyeong-gun, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a processing chamber; a susceptor provided in the processing chamber, where...