ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,708, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor packages" was invented by Sang Sub Song (Suwon-si, South Korea), Seongho Yoon (Suwon-si, South Korea) and Ki-Hong Jeong (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate having opposing first and second surfaces, a control chip on the first surface, a mode selection connection terminal between the control chip and the package substrate, a stack structure comprising stacked memory chips spaced apart from the control chip on the first surface, a first power pad and a wire ...