US Patent Issued to SAMSUNG ELECTRONICS on Oct. 28 for "Semiconductor package and method for manufacturing semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,704, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method for manufacturing semiconductor package" was invented by Yonghwan Kwon (Yongin-si, South Korea) and Yongjin Park (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution structure, including a first insulating layer and a first redistribution layer disposed below the first insulating layer; a semiconductor chip disposed on the first redistribution structure, including a connection terminal electrically connected to the first redistribution layer and burie...