ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,711, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Chihong Shin (Suwon-si, South Korea) and Raehyung Do (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate having substrate pads disposed in a first direction on one surface, a semiconductor chip having chip pads disposed in the first direction, and bonding wires connecting the chip pads and the substrate pads. The bonding wires include first and second bonding wires alternately connected to the substrate pads respectively, in the first direction, th...