ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,660, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Yongkwan Lee (Hwaseong-si, South Korea), Seunghwan Kim (Asan-si, South Korea), Jungjoo Kim (Hwaseong-si, South Korea), Jongwan Kim (Asan-si, South Korea) and Junwoo Park (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes a package substrate, an interposer including a lower protective layer, conductive connectors connecting the package substrate to the interposer, a semiconductor chip arranged between the package substrate and the...