ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,671, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Eunkyul Oh (Suwon-si, South Korea), Chonghee Lee (Suwon-si, South Korea), Keunho Jang (Suwon-si, South Korea) and Yunrae Cho (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate including a redistribution layer including first pads and second pads on an upper surface thereof and a solder mask layer having an opening exposing the first pads entirely and exposing at least portion of each of the second pads, a semiconductor chip on the upper surface of...