US Patent Issued to SAMSUNG ELECTRONICS on Oct. 28 for "Semiconductor devices and methods of forming the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,797, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea).

"Semiconductor devices and methods of forming the same" was invented by Sung-Min Kim (Incheon, South Korea), Sunhom Steve Paak (Seoul, South Korea), Heon-Jong Shin (Yongin-si, South Korea) and Dong-Ho Cha (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of forming the semiconductor devices are provided. The methods may include forming a fin, forming a first device isolating layer on a side of the fin, forming a second device isolating layer extending through the first device isolating layer, forming ...