ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,631, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of manufacturing semiconductor device" was invented by Hyungjun Jeon (Seoul, South Korea), Taeyeong Kim (Yongin-si, South Korea), Hoechul Kim (Seoul, South Korea) and Junhong Min (Ulsan, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding method for bonding a first substrate to a second substrate includes fixing the first substrate to a first surface of a first bonding chuck and fixing the second substrate to a second surface of a second bonding chuck, the second surface facing the first surface; aligning the second bonding chuck ab...